DIP64 (LONG) Heat Sink: Glue On / Thermal Epoxy Compact Style (DIP 64)

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Quick Overview

Aluminum DIP64, PDIP64 heat sink

DIP64 (LONG) Heat Sink: Glue On / Thermal Epoxy Compact Style (DIP 64)

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  • Motorola 68000 / Sega Genesis Example

Details

A glue-on / epoxy-on compact style heatsink for DIP64 ICs with 0.1 inch (2.54) mm pin spacing.

3in (76mm) length, 0.3" (7.62mm) height.

Many 68000 and 68010 CPUs are this size

Thermal epoxy or thermal tape attachment recommended.

Additional Information

Compatible Hardware Apple Macintosh, Sega Genesis
About Console5 Products

Unless noted in the description, all Console5 products are fully tested and guaranteed.  Cap kits are made using name brand, high quality, high-temp parts from Nichicon, Panasonic, and other reputable companies.